In time, the expansion of This method to a full wafer, or far better, the usage of a significant resolution X-ray diffraction imaging (XRDI) technique, to provide a full 3D defect map in the Wise Slice layer could well be useful to show the defect density above the whole wafer. https://www.quora.com/profile/Trevor-Flatcher-2/Advantages-of-Silicon-Carbide-Materials-in-High-Temperature-Electronic-Devices-Silicon-carbide-SiC-has-emerged-as-a-c